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Category: Up and Comers

Huawei claims the Pocket 2 is the world's first flip foldable smartphone with four cameras on its cover.
Posted inUp and Comers

Huawei unveils Pocket 2, a stylish flip phone with satellite communication

Avatar photo by Jessie Wu Feb 23, 2024Feb 23, 2024
Mobility new energy vehicle electric vehicle EV nio capital venture capital VC china self-driving cars autonomous driving
Posted inOn the Cusp

NIO Capital raises new RMB 3 billion fund despite cooling VC climate

Avatar photo by Jill Shen Feb 6, 2024Feb 6, 2024
Posted inUp and Comers

Vision Pro and Quest rival XREAL secures $60 million to expand AR devices production: report

Avatar photo by Jessie Wu Jan 31, 2024Jan 31, 2024
Currently, ASML's lithography systems require an export license from the Dutch government for shipment.
Posted inUp and Comers

China’s imports of chip-making equipment rose by 93% in Q3: report

Avatar photo by Jessie Wu Nov 15, 2023Nov 15, 2023
new energy vehicles autonomous driving electric cars xpeng nio tesla china ev
Posted inTurf Wars

Xpeng Motors offers coupons following customer complaints about unfulfilled assisted driving features

Avatar photo by Jill Shen Nov 6, 2023Nov 6, 2023
a photo taken by Xiaomi 14 Pro
Posted inUp and Comers

Xiaomi 14 series debuts firm’s own HyperOS and first phones with Snapdragon 8 Gen 3 processors

Avatar photo by Jessie Wu Oct 27, 2023Oct 27, 2023
The camera setup on the Oppo Find N3 features Hasselblad branding.
Posted inUp and Comers

Oppo launches the Find N3, a foldable smartphone with flagship imaging capabilities

Avatar photo by Jessie Wu Oct 20, 2023Oct 20, 2023
Mobility new energy vehicles electric vehicles EV leapmotor EREV extended-range EV Volkswagen Stellantis China Europe
Posted inUp and Comers

Leapmotor achieves positive gross margin on strong revenue in Q3

Avatar photo by Jill Shen Oct 17, 2023Oct 17, 2023
Huawei has obtained a smartphone microscope-camera technology patent.
Posted inUp and Comers

Huawei patents mobile phone microscope camera that can detect bacteria

Avatar photo by Jessie Wu Oct 9, 2023Oct 9, 2023
CoWoS is a high-density advanced packaging technology developed by TSMC for high-performance chips.
Posted inUp and Comers

TSMC’s advanced packaging capacity under strain as Nvidia, AMD, and Amazon increase orders for AI chips: report

Avatar photo by Jessie Wu Sep 25, 2023Sep 25, 2023

Posts pagination

Newer posts 1 2 3 4 5 … 64 Older posts

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